{
 "company": "synopsys",
 "as_of": "2026-10-08",
 "choices": [
  {
   "id": "synopsys-p01",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "Synthesis origin",
   "statement": "The founding team brought synthesis technology out of General Electric.",
   "event_date": "1986",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-p02",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "Circuit generation",
   "statement": "Synthesis translated a functional description into circuit logic rather than merely recording a drawing.",
   "event_date": "1986",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-p03",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "Optimization",
   "statement": "The team used algorithms to improve gate-level implementation.",
   "event_date": "1986",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-g01",
   "business": "Electronic design automation and semiconductor IP",
   "category": "go_to_market",
   "dimension": "Spinout support",
   "statement": "General Electric provided support and transferred technology to the founding team.",
   "event_date": "1986",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-p04",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "Manufacturing collaboration",
   "statement": "Executives described engineers working with foundries during process development.",
   "event_date": "2024",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-p05",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "Verification",
   "statement": "Generated designs still required verification before fabrication.",
   "event_date": "2024",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-p06",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "Reusable blocks",
   "statement": "The business sold semiconductor IP alongside design tools.",
   "event_date": "2024",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-g02",
   "business": "Electronic design automation and semiconductor IP",
   "category": "go_to_market",
   "dimension": "Technical relationships",
   "statement": "Customer and foundry engineering relationships supported product development and adoption.",
   "event_date": "2024",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-g03",
   "business": "Electronic design automation and semiconductor IP",
   "category": "go_to_market",
   "dimension": "Account breadth",
   "statement": "EDA and IP served related needs within semiconductor customers.",
   "event_date": "2024",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "SY1"
   ]
  },
  {
   "id": "synopsys-p07",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "EDA access",
   "statement": "Technology Subscription Licenses bundled software with continuing updates.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "SY3"
   ]
  },
  {
   "id": "synopsys-p08",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "Engineering simulation",
   "statement": "The completed Ansys acquisition added broad simulation and analysis software.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "SY3"
   ]
  },
  {
   "id": "synopsys-p09",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "IP resource allocation",
   "statement": "Management began reallocating resources after underperformance in Design IP.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "SY3"
   ]
  },
  {
   "id": "synopsys-p10",
   "business": "Electronic design automation and semiconductor IP",
   "category": "product",
   "dimension": "Complementary hardware",
   "statement": "Design Automation growth included strong demand for hardware products.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "SY3"
   ]
  },
  {
   "id": "synopsys-g04",
   "business": "Electronic design automation and semiconductor IP",
   "category": "go_to_market",
   "dimension": "Term agreements",
   "statement": "Software arrangement periods typically approximated two to three years.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "SY3"
   ]
  },
  {
   "id": "synopsys-g05",
   "business": "Electronic design automation and semiconductor IP",
   "category": "go_to_market",
   "dimension": "Portfolio commitments",
   "statement": "Flexible Spending Account commitments allowed product selection after the commercial commitment.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "SY3"
   ]
  },
  {
   "id": "synopsys-g06",
   "business": "Electronic design automation and semiconductor IP",
   "category": "go_to_market",
   "dimension": "Backlog",
   "statement": "Contracted remaining obligations reached about $11.4 billion, including $2.0 billion of non-cancellable flexible commitments.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "SY3"
   ]
  },
  {
   "id": "synopsys-g07",
   "business": "Electronic design automation and semiconductor IP",
   "category": "go_to_market",
   "dimension": "Geographic constraint",
   "statement": "Revenue in China excluding Ansys fell 22% amid export restrictions and other headwinds.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "SY3"
   ]
  }
 ]
}