{
 "company": "pdf-solutions",
 "as_of": "2026-10-08",
 "choices": [
  {
   "id": "pdf-solutions-p01",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Initial offer",
   "statement": "PDF began with software for simulating manufacturability.",
   "event_date": "1991",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-p02",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Combined delivery",
   "statement": "By 2003, technology was supplied within yield-improvement solutions rather than as isolated tools.",
   "event_date": "2003",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-p03",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Customer engineering",
   "statement": "On-site teams worked alongside customer engineers to implement methods and tools.",
   "event_date": "2003",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-p04",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Test structures",
   "statement": "Characterization Vehicle test chips helped measure design-process interactions.",
   "event_date": "2003",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-p05",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Yield simulation",
   "statement": "Yield Ramp Simulator analyzed the effect of design attributes and process variations.",
   "event_date": "2003",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-p06",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Electrical test",
   "statement": "The pdFasTest system accelerated testing of characterization chips.",
   "event_date": "2003",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-g01",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "go_to_market",
   "dimension": "Performance-linked fees",
   "statement": "Gain Share linked vendor compensation to customer results.",
   "event_date": "2003",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-g02",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "go_to_market",
   "dimension": "Named customer set",
   "statement": "Kibarian identified Infineon, Toshiba and Sony among customers.",
   "event_date": "2003",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-g03",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "go_to_market",
   "dimension": "On-site delivery",
   "statement": "Consulting teams worked with clients from offices in the United States, Europe and Japan.",
   "event_date": "2003",
   "date_precision": "year",
   "evidence_kind": "participant_account",
   "sources": [
    "PD1"
   ]
  },
  {
   "id": "pdf-solutions-p07",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Supply-chain data",
   "statement": "Exensio connected analytics across design, fabrication, assembly and test.",
   "event_date": "2020",
   "date_precision": "year",
   "evidence_kind": "documented_offer_or_action",
   "sources": [
    "PD3"
   ]
  },
  {
   "id": "pdf-solutions-p08",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Test integration",
   "statement": "Advantest agreed to develop cloud offerings based on Exensio.",
   "event_date": "2020",
   "date_precision": "year",
   "evidence_kind": "documented_offer_or_action",
   "sources": [
    "PD3"
   ]
  },
  {
   "id": "pdf-solutions-g04",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "go_to_market",
   "dimension": "Anchor subscription",
   "statement": "Advantest agreed to a five-year cloud subscription alongside development and commercial agreements.",
   "event_date": "2020",
   "date_precision": "year",
   "evidence_kind": "documented_offer_or_action",
   "sources": [
    "PD3"
   ]
  },
  {
   "id": "pdf-solutions-g05",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "go_to_market",
   "dimension": "Capital relationship",
   "statement": "The partnership included approximately $65.2 million for newly issued PDF shares.",
   "event_date": "2020",
   "date_precision": "year",
   "evidence_kind": "documented_offer_or_action",
   "sources": [
    "PD3"
   ]
  },
  {
   "id": "pdf-solutions-p09",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Equipment software",
   "statement": "Cimetrix runtime software contributed equipment-related revenue.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "PD2"
   ]
  },
  {
   "id": "pdf-solutions-p10",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Data connectivity",
   "statement": "secureWISE data usage formed part of the connected-data business.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "PD2"
   ]
  },
  {
   "id": "pdf-solutions-p11",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "product",
   "dimension": "Enterprise integration",
   "statement": "Sapience linked factory-floor data with enterprise applications.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "PD2"
   ]
  },
  {
   "id": "pdf-solutions-g06",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "go_to_market",
   "dimension": "Account expansion",
   "statement": "Sales and service teams sought broader use across a customer\u2019s products, processes and technologies.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "PD2"
   ]
  },
  {
   "id": "pdf-solutions-g07",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "go_to_market",
   "dimension": "Commercial mix",
   "statement": "Platform revenue combined software, services and other fixed-fee offerings.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "PD2"
   ]
  },
  {
   "id": "pdf-solutions-g08",
   "business": "Semiconductor manufacturing analytics and yield software",
   "category": "go_to_market",
   "dimension": "Volume fees",
   "statement": "Runtime licenses, data usage and Gainshare made up Volume-based revenue.",
   "event_date": "2025",
   "date_precision": "year",
   "evidence_kind": "company_described_offering",
   "sources": [
    "PD2"
   ]
  }
 ]
}